Ceramic Small Outline Packages

Standard packages and lids for device evaluation. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Also used as a structural material in ceramic.

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Ceramic small outline packages.

Lead count cavity overall layer t hic kness total 0084 0085 0085 0085 lead nt k mat erial code ring connection drawing no o non co ne ct attach. Material properties process flow. Ceramic substrates for probe cards. Copper cu a copper alloy a copper nickel tin alloy is used as the lead frame material in plastic packages.

Ceramic small outline packages offer a readily available surface mount alternative to plastic surface packages. Mm lead count cavity overall layer thickness lead ntk material code b black w white connection 0 non conect drawing no. Ceramic small outline package csop national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. Small outline package straight lead small outline l leaded package 1 27.

Csop ceramic small outline packages mm inch unit. Ceramic packages for large scale integration lsi devices. Material in laminated ceramic packages. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition.

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