Ceramic Thermal Grease

The high density ceramic based thermal compound specifically designed for modern high power cpus and high performance heatsinks or water cooling solutions.

Ceramic thermal grease.

Arctic silver 5 as5 3 5g thermal paste thermal paste its unique high density filling of micronized silver and enhanced thermally conductive ceramic particles arctic silver 5 provides a new level of performance and stability. You can opt for silicon based metal based ceramic based or carbon based thermal paste. Best thermal paste for cpu gpu overclocking and laptop coolers. Thermal grease and thermal paste are the same thing.

These thermal compounds can be used with both cpu air coolers and water liquid cpu coolers for processors and graphics cards. With a thermal conductivity rating of 8 5 w mk this ceramic based thermal compound can keep your temperatures down for 5 years after application. Like the original céramique céramique 2 uses only ceramic fillers so it is neither electrically conductive nor capacitive. Arctic silver 5 is the reference premium thermal compound.

The cpu thermal compound is paste or grease like substance that is known by different names such as thermal paste thermal grease and thermal interface material tim. The paste has a temperature limit of 150ºc while some thermal pastes can withstand up to 300ºc. V how to apply thermal paste. Benefits of thermal paste you can make use of cpu thermal grease to get well heat dissipation and decrease the cpu temperature by applying it to the contact surfaces of cpu and.

Whether you re a beginner looking for a thermal paste you can rely on or an advanced builder you know the noctua nt h1 has what it takes to give you decent cooling performance. The thermal paste flows nonstop in liquid form to ensure that the system is safe from overheating. Available at arctic silver resellers worldwide. Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.