Ceramic Ultrasonic Machining

Ultrasonic machine is useful for hard material.

Ceramic ultrasonic machining.

Ultrasonic machining or strictly speaking the is a subtraction manufacturing process that removes material from the surface of a part through high frequency low amplitude vibrations of a tool against the material surface in the presence of fine abrasive particles. Diamond is cut for the desired shapes. Material removal is achieved by the direct and indirect hammering of abrasive particles against a workpiece by means of an ultrasonically vibrating tool. As a result no post machining polishing or annealing processes are required to relieve residual stress and slag caused by laser.

Advantages of ultrasonic machining. The amplitude of vibration 0 0005 0 002 13 50 μm. Ultrasonic machining is the oldest form of machining process which can be used to machine brittle materials such as glass and ceramics. The influence of different process parameters on the material removal rate for machining of magnesia stabilized zirconia is examined.

The paper says about parametric optimization of ultrasonic. This is precise enough to be used in the creation of micro electro mechanical system components such as micro structured glass wafers. Machining hard ceramics or soft optical materials has never been faster or easier. Machining the glasses ceramics.

During the operation the tool is pressed to the workpiece at a constant load. The vibration frequency is 19 25 khz. The tool travels vertically or orthogonal to the surface of the part at amplitudes of 0 05 to 0 125 mm 0 002 to 0 005 in. Then a mechanistic approach to modeling the material removal rate during rotary ultrasonic drilling of ceramics is proposed and applied to predicting the material removal.

Non thermal process creates no haz and little or no subsurface damage. Ultrasonic machining is a low material removal rate mrr loose abrasive machining process in which the mirror image of a shaped tool can be created in hard brittle materials. Machining the precise mineral stones tungsten. Optisonic 500 series entry level ultrasonic machining centers with 500mm of x axis travel the optisonic 500 series features 3 4 or 5 axes of motion in a robust platform that incorporates the latest ultrasonic technology and 500mm of x axis travel.

Ultrasonic machining offers many advantages over conventional laser machining of ceramic substrates. This method is the best choice for working with hard materials such as ceramic matrix composites ruby piezo ceramics glass ceramics quartz ferrite diamonds technical ceramics alumina pcd sapphire cvd silicon carbide and similar ones. Lower total cost higher yield. An experimental study of the rotary ultrasonic drilling of ceramics is first presented.